| Compare | Image | Name | Manufacturer | Quantity | Mfr | Series | Package | Product Status | Operating Temperature | Mounting Type | Package / Case | Type | Features | Base Product Number | Input Type | Output Type | Digi-Key Programmable | Voltage - Supply | Supplier Device Package | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Logic Type | Number of Elements | Number of Bits per Element | Current - Output High, Low | Number of I/O | Core Processor | Core Size | Speed | Connectivity | Peripherals | Program Memory Size | Program Memory Type | EEPROM Size | RAM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Max Output Power x Channels @ Load | Interface | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | SATA | USB | Voltage - I/O | Security Features | Additional Interfaces | Clock Rate | Non-Volatile Memory | On-Chip RAM | Voltage - Core |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| NXP USA Inc. MC56F8006VLF557 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | * | Bulk | Active | download | 0000.00.0000 | 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
NXP USA Inc. S9S08QD4J1MSC | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Bulk | Active | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | S9S08 | 8-SOIC | download | 2156-S9S08QD4J1MSC-FR | EAR99 | 8542.31.0001 | 1 | 4 | S08 | 8-Bit | 16MHz | - | LVD, POR, PWM, WDT | 4KB (4K x 8) | FLASH | - | 256 x 8 | 2.7V ~ 5.5V | A/D 4x10b | Internal | |||||||||||||||||||||||||||||||
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NXP USA Inc. PN5120A0ET/C2151 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | * | Bulk | Active | Not Verified | download | EAR99 | 8542.39.0001 | 1 | |||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MKS22FN256VLL12557 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | * | Bulk | Active | Not Verified | download | 0000.00.0000 | 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||
|
NXP USA Inc. SAF3600EL/V1042D557 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | * | Bulk | Active | download | EAR99 | 8542.39.0001 | 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. LPC1113FHN33/201551 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | LPC1100 | Bulk | Active | -40°C ~ 85°C (TA) | Surface Mount | 32-VQFN Exposed Pad | LPC1113 | 32-HVQFN (7x7) | download | 3A991A2 | 8542.31.0001 | 1 | 28 | ARM® Cortex®-M0 | 32-Bit Single-Core | 50MHz | I²C, SPI, UART/USART | Brown-out Detect/Reset, POR, WDT | 24KB (24K x 8) | FLASH | - | 4K x 8 | 1.8V ~ 3.6V | A/D 8x10b | Internal | |||||||||||||||||||||||||||||||||
| NXP USA Inc. LPC1113FHN33/303551 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | LPC1100XL | Bulk | Active | -40°C ~ 85°C (TA) | Surface Mount | 32-VQFN Exposed Pad | LPC1113 | 32-HVQFN (7x7) | download | 3A991A2 | 8542.31.0001 | 1 | 28 | ARM® Cortex®-M0 | 32-Bit Single-Core | 50MHz | I²C, SPI, UART/USART | Brown-out Detect/Reset, POR, WDT | 24KB (24K x 8) | FLASH | - | 8K x 8 | 1.8V ~ 3.6V | A/D 8x10b | Internal | |||||||||||||||||||||||||||||||||
| NXP USA Inc. 74ALVC245D,118 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | 74ALVC | Bulk | Active | -40°C ~ 85°C (TA) | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 74ALVC245 | - | 3-State | 1.65V ~ 3.6V | 20-SO | download | EAR99 | 8542.39.0001 | 1 | Transceiver, Non-Inverting | 1 | 8 | 24mA, 24mA | |||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. 74AHC157D112 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | * | Bulk | Active | 74AHC157 | download | EAR99 | 8542.39.0001 | 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||
|
NXP USA Inc. SAF3560HV/V1106K | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Automotive, AEC-Q100 | Tray | Obsolete | -40°C ~ 85°C (TA) | Surface Mount | 144-LQFP Exposed Pad | Digital Radio Processor | 144-HLQFP (20x20) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 568-SAF3560HV/V1106K | OBSOLETE | 60 | I²C, I²S, SPI, UART | 3.30V | 96kHz | - | 64kB | 3.30V | ||||||||||||||||||||||||||||||||||||
| NXP USA Inc. TDF8532HH/N2/S710K | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | TDF | Tray | Obsolete | - | Surface Mount | 100-FQFP Exposed Pad | Class D | - | 4-Channel (Quad) | 5.5V ~ 25V | 100-HLQFP (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 568-TDF8532HH/N2/S710K | OBSOLETE | 90 | 80W x 4 @ 2Ohm | |||||||||||||||||||||||||||||||||||||||
|
NXP USA Inc. SAF3561EL/V1101,55 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Obsolete | -40°C ~ 85°C (TA) | Surface Mount | 170-LFBGA | Digital Radio Processor | 170-LFBGA (12x12) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 568-SAF3561EL/V1101,55 | OBSOLETE | 945 | I²C, I²S, SPI, UART | 3.30V | 96kHz | - | 64kB | 3.30V | |||||||||||||||||||||||||||||||||||||
| NXP USA Inc. TDF8534HH/N2/S710Y | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Automotive, AEC-Q100 | Tape & Reel (TR) | Obsolete | - | Surface Mount | 100-FQFP Exposed Pad | Class D | - | 5-Channel | 5.5V ~ 25V | 100-HLQFP (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 568-TDF8534HH/N2/S710YTR | OBSOLETE | 1,000 | 80W x 5 @ 4Ohm | |||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. TDF8531HH/N2/S710Y | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Automotive, AEC-Q100 | Tape & Reel (TR) | Obsolete | - | Surface Mount | 100-FQFP Exposed Pad | Class D | - | 3-Channel | 5.5V ~ 25V | 100-HLQFP (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 568-TDF8531HH/N2/S710YTR | OBSOLETE | 1,000 | 80W x 3 @ 2Ohm | |||||||||||||||||||||||||||||||||||||||
|
NXP USA Inc. SAF3560HV/V1100,51 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Automotive, AEC-Q100 | Tape & Reel (TR) | Obsolete | -40°C ~ 85°C (TA) | Surface Mount | 144-LQFP Exposed Pad | Digital Radio Processor | 144-HLQFP (20x20) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 568-SAF3560HV/V1100,51TR | OBSOLETE | 750 | I²C, I²S, SPI, UART | 3.30V | 96kHz | - | 64kB | 3.30V | ||||||||||||||||||||||||||||||||||||
| NXP USA Inc. TDF8531HH/N2/S710K | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Automotive, AEC-Q100 | Tray | Obsolete | - | Surface Mount | 100-FQFP Exposed Pad | Class D | - | 3-Channel | 5.5V ~ 25V | 100-HLQFP (14x14) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 568-TDF8531HH/N2/S710K | OBSOLETE | 90 | 80W x 3 @ 2Ohm | ||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. TDF8534HH/N2/S710K | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Automotive, AEC-Q100 | Tray | Obsolete | - | Surface Mount | 100-FQFP Exposed Pad | Class D | - | 5-Channel | 5.5V ~ 25V | 100-HLQFP (14x14) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 568-TDF8534HH/N2/S710K | OBSOLETE | 90 | 80W x 5 @ 4Ohm | ||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MIMXRT1064DVL6B | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | RT1064 | Tray | Active | 0°C ~ 95°C (TJ) | Surface Mount | 196-LFBGA | MIMXRT1064 | 196-MAPBGA (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 240 | 127 | ARM® Cortex®-M7 | 32-Bit Single-Core | 600MHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG | Brown-out Detect/Reset, DMA, POR, PWM, WDT | 4MB (4M x 8) | FLASH | - | 1M x 8 | 3V ~ 3.6V | A/D 20x12b | External, Internal | ||||||||||||||||||||||||||||||
| NXP USA Inc. MIMXRT1064CVL5B | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | RT1064 | Tray | Active | -40°C ~ 105°C (TJ) | Surface Mount | 196-LFBGA | MIMXRT1064 | 196-MAPBGA (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 240 | 127 | ARM® Cortex®-M7 | 32-Bit Single-Core | 528MHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG | Brown-out Detect/Reset, DMA, POR, PWM, WDT | 4MB (4M x 8) | FLASH | - | 1M x 8 | 3V ~ 3.6V | A/D 20x12b | External, Internal | ||||||||||||||||||||||||||||||
| NXP USA Inc. LPC5506JBD64E | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 64-TQFP Exposed Pad | LPC5506 | 64-HTQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 160 | 45 | ARM® Cortex®-M33 | 32-Bit Single-Core | 96MHz | CANbus, Flex COMM, I²C, SPI, UART/USART | Brown-out Detect/Reset, DMA, I²S, POR, PWM, RNG, WDT | 256KB (256K x 8) | FLASH | - | 96K x 8 | 1.8V ~ 3.6V | A/D 9x16b SAR | Internal | ||||||||||||||||||||||||||||||
| NXP USA Inc. LPC55S06JBD64E | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | LPC55S0x | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 64-TQFP Exposed Pad | LPC55S06 | 64-HTQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 160 | 45 | ARM® Cortex®-M33 | 32-Bit Single-Core | 96MHz | CANbus, Flex COMM, I²C, SPI, UART/USART | Brown-out Detect/Reset, DMA, I²S, POR, PWM, RNG, WDT | 256KB (256K x 8) | FLASH | - | 96K x 8 | 1.8V ~ 3.6V | A/D 9x16b SAR | Internal | ||||||||||||||||||||||||||||||
| NXP USA Inc. MCIMX536AVP8C2R2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX53 | Tape & Reel (TR) | Active | -40°C ~ 125°C (TJ) | Surface Mount | 529-FBGA | MCIMX536 | 529-FBGA (19x19) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 750 | ARM® Cortex®-A8 | 800MHz | 1 Core, 32-Bit | Multimedia; NEON™ SIMD | DDR2, DDR3, LPDDR2 | Yes | Keypad, LCD | 10/100Mbps (1) | SATA 1.5Gbps (1) | USB 2.0 (2), USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1) | 1.3V, 1.8V, 2.775V, 3.3V | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | 1-Wire, AC'97, CAN, I²C, I²S, MMC/SD, SAI, SPI, SSI, UART | |||||||||||||||||||||||||||||||||
| NXP USA Inc. LPC1111FHN33/103K | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | LPC1100XL | Bulk | Active | -40°C ~ 85°C (TA) | Surface Mount | 32-VQFN Exposed Pad | LPC1111 | 32-HVQFN (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A | 8542.31.0001 | 1,300 | 28 | ARM® Cortex®-M0 | 32-Bit Single-Core | 50MHz | I²C, SPI, UART/USART | Brown-out Detect/Reset, POR, WDT | 8KB (8K x 8) | FLASH | - | 2K x 8 | 1.8V ~ 3.6V | A/D 8x10b SAR | Internal | ||||||||||||||||||||||||||||||
|
NXP USA Inc. LX2162RC82029B | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | QorIQ LX | Tray | Active | 5°C ~ 105°C (TA) | Surface Mount | 1150-FBGA | 1150-FBGA (23x23) | ROHS3 Compliant | REACH Unaffected | 60 | ARM® Cortex®-A72 | 2GHz | 16 Core, 64-Bit | - | DDR4, SDRAM | No | - | - | SATA 6Gbps (4) | USB 3.0 (1) | - | - | CANbus, I²C, PCIe, SPI, UART | ||||||||||||||||||||||||||||||||||
|
NXP USA Inc. LX2082RE82029B | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | QorIQ LX | Tray | Active | 5°C ~ 105°C (TA) | Surface Mount | 1150-FBGA | 1150-FBGA (23x23) | ROHS3 Compliant | REACH Unaffected | 60 | ARM® Cortex®-A72 | 2GHz | 8 Core, 64-Bit | - | DDR4, SDRAM | No | - | - | SATA 6Gbps (4) | USB 3.0 (1) | - | - | CANbus, I²C, PCIe, SPI, UART | ||||||||||||||||||||||||||||||||||
|
NXP USA Inc. LX2122RC82029B | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | QorIQ LX | Tray | Active | 5°C ~ 105°C (TA) | Surface Mount | 1150-FBGA | 1150-FBGA (23x23) | ROHS3 Compliant | REACH Unaffected | 60 | ARM® Cortex®-A72 | 2GHz | 12 Core, 64-Bit | - | DDR4, SDRAM | No | - | - | SATA 6Gbps (4) | USB 3.0 (1) | - | - | CANbus, I²C, PCIe, SPI, UART | ||||||||||||||||||||||||||||||||||
|
NXP USA Inc. LX2122RN82029B | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | QorIQ LX | Tray | Active | 5°C ~ 105°C (TA) | Surface Mount | 1150-FBGA | 1150-FBGA (23x23) | ROHS3 Compliant | REACH Unaffected | 60 | ARM® Cortex®-A72 | 2GHz | 12 Core, 64-Bit | - | DDR4, SDRAM | No | - | - | SATA 6Gbps (4) | USB 3.0 (1) | - | - | CANbus, I²C, PCIe, SPI, UART | ||||||||||||||||||||||||||||||||||
|
NXP USA Inc. LX2122RE82029B | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | QorIQ LX | Tray | Active | 5°C ~ 105°C (TA) | Surface Mount | 1150-FBGA | 1150-FBGA (23x23) | ROHS3 Compliant | REACH Unaffected | 60 | ARM® Cortex®-A72 | 2GHz | 12 Core, 64-Bit | - | DDR4, SDRAM | No | - | - | SATA 6Gbps (4) | USB 3.0 (1) | - | - | CANbus, I²C, PCIe, SPI, UART | ||||||||||||||||||||||||||||||||||
|
NXP USA Inc. LPC4333JET256 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | LPC43xx | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 256-LBGA | LPC4333 | 256-LBGA (17x17) | ROHS3 Compliant | 3 (168 Hours) | REACH Affected | 2832-LPC4333JET256 | EAR99 | 8542.31.0001 | 90 | 164 | ARM® Cortex®-M4/M0 | 32-Bit Dual-Core | 204MHz | CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG | Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT | 512KB (512K x 8) | FLASH | 16K x 8 | 136K x 8 | 2.2V ~ 3.6V | A/D 8x10b; D/A 1x10b | Internal | |||||||||||||||||||||||||||||
| NXP USA Inc. MCIMX535DVP2C2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX53 | Tray | Active | -20°C ~ 85°C (TC) | Surface Mount | 529-FBGA | MCIMX535 | 529-FBGA (19x19) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 84 | ARM® Cortex®-A8 | 1.2GHz | 1 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, DDR2, DDR3 | Yes | Keypad, LCD | 10/100Mbps (1) | SATA 1.5Gbps (1) | USB 2.0 (2), USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1) | 1.3V, 1.8V, 2.775V, 3.3V | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | 1-Wire, AC'97, I²C, I²S, MMC/SD, SAI, SPI, SSI, UART |
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