| Compare | Image | Name | Manufacturer | Quantity | Mfr | Series | Package | Product Status | Operating Temperature | Size / Dimension | Base Product Number | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | Other Names | ECCN | HTSUS | Standard Package | Core Processor | Speed | RAM Size | Flash Size | Module/Board Type | Co-Processor | Connector Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
Trenz Electronic GmbH 0820-05-4DE21MA | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0820 | Bulk | Active | 0°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | 1686-TE0820-05-4DE21MA | 1 | ARM® Cortex®-A53, ARM® Cortex®-R5 | - | 2GB | 128MB | MPU Core | Xilinx Zynq UltraScale+ XCZU4EV-1SFVC784E | Pin(s) | ||||||
|
Trenz Electronic GmbH 0820-05-2BE21MA | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0820 | Bulk | Active | 0°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | 1686-TE0820-05-2BE21MA | 1 | ARM® Cortex®-R5 | - | 2GB | 128MB | MPU Core | Xilinx Zynq UltraScale+ XCZU2EG-1SFVC784E | Pin(s) | ||||||
|
Trenz Electronic GmbH 0820-05-3BE21ML | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0820 | Bulk | Active | 0°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | 1686-TE0820-05-3BE21ML | 1 | ARM® Cortex®-A53, ARM® Cortex®-R5 | - | 2GB | 128MB | MPU Core | Xilinx Zynq UltraScale+ XCZU3EG-1SFVC784E | Pin(s) | ||||||
|
Trenz Electronic GmbH 0820-05-2AI21MA | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0820 | Bulk | Active | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | Not Applicable | 1686-TE0820-05-2AI21MA | 1 | ARM® Cortex®-A53, ARM® Cortex®-R5 | - | 2GB | 128MB | MPU Core | Xilinx Zynq UltraScale+ XCZU2CG-1SFVC784I | Pin(s) | |||||
|
Trenz Electronic GmbH 0807-03-4AI21-A | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0807 | Box | Active | -40°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | TE0807 | download | ROHS3 Compliant | Not Applicable | 1686-TE0807-03-4AI21-A | 1 | Zynq UltraScale+ XCZU4CG-1FBVB900I | - | 4GB | 128MB | MPU Core | - | B2B | |||
|
Trenz Electronic GmbH 0807-03-7DI21-A | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0807 | Box | Active | -40°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | TE0807 | download | ROHS3 Compliant | Not Applicable | 1686-TE0807-03-7DI21-A | 1 | Zynq UltraScale+ XCZU7EV-1FBVB900I | - | 4GB | 128MB | MPU Core | - | B2B | |||
|
Trenz Electronic GmbH 0820-04-2BE21FL | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0820 | Bulk | Obsolete | 0°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | TE0820 | download | ROHS3 Compliant | Not Applicable | 1686-TE0820-04-2BE21FL | OBSOLETE | 1 | Zynq UltraScale+ XCZU2EG-1SFVC784E | - | 2GB | 128MB | MPU Core | - | Samtec LSHM | ||
|
Trenz Electronic GmbH 0820-04-3BE21FA | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0820 | Bulk | Obsolete | 0°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | TE0820 | download | ROHS3 Compliant | Not Applicable | 1686-TE0820-04-3BE21FA | OBSOLETE | 1 | Zynq UltraScale+ XCZU3EG-1SFVC784E | - | 2GB | 128MB | MPU Core | - | Samtec LSHM | ||
|
Trenz Electronic GmbH 0820-04-3BE21FL | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0820 | Bulk | Obsolete | 0°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | TE0820 | download | ROHS3 Compliant | Not Applicable | 1686-TE0820-04-3BE21FL | 5A002A1 | 8471.50.0150 | 1 | Zynq UltraScale+ XCZU3EG-1SFVC784E | - | 2GB | 128MB | MPU Core | - | Samtec LSHM | |
|
Trenz Electronic GmbH 0820-04-2AI21FA | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0820 | Bulk | Obsolete | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | TE0820 | download | ROHS3 Compliant | Not Applicable | 1686-TE0820-04-2AI21FA | OBSOLETE | 1 | Zynq UltraScale+ XCZU2CG-1SFVC784I | - | 2GB | 128MB | MPU Core | - | Samtec LSHM | ||
|
Trenz Electronic GmbH S00021-02 | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | * | Bulk | Active | ROHS3 Compliant | Not Applicable | 1686-S00021-02 | 1 | ||||||||||||||
|
Trenz Electronic GmbH 0745-02-91C31-A | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0745 | Bulk | Active | -40°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | download | ROHS3 Compliant | Not Applicable | 1686-TE0745-02-91C31-A | 1 | ARM Cortex-A9 | - | 1GB | 64MB | MCU, FPGA | Zynq-7000 (Z-7045) | Board-to-Board (BTB) Socket - 480 | ||||
|
Trenz Electronic GmbH 0745-02-71I31-AZ | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0745 | Bulk | Active | -40°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | download | ROHS3 Compliant | Not Applicable | 3A991D | 8473.30.1180 | 1 | ARM Cortex-A9 | - | 1GB | 64MB | MCU, FPGA | Zynq-7000 (Z-7030) | Board-to-Board (BTB) Socket - 160 | |||
|
Trenz Electronic GmbH 0745-02-81C31-AK | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0745 | Bulk | Active | -40°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | ROHS3 Compliant | Not Applicable | 1686-TE0745-02-81C31-AK | 1 | ARM Cortex-A9 | - | 1GB | 64MB | MCU, FPGA | Zynq-7000 (Z-7035) | Board-to-Board (BTB) Socket - 480 | |||||
|
Trenz Electronic GmbH S00005-02 | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | * | Bulk | Active | ROHS3 Compliant | Not Applicable | 1686-S00005-02 | 1 | ||||||||||||||
|
Trenz Electronic GmbH 0745-02-81C11-AK | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0745 | Bulk | Obsolete | -40°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | ROHS3 Compliant | Not Applicable | 1686-TE0745-02-81C11-AK | OBSOLETE | 1 | ARM Cortex-A9 | - | 1GB | 64MB | MCU, FPGA | Zynq-7000 (Z-7035) | Board-to-Board (BTB) Socket - 480 | ||||
|
Trenz Electronic GmbH 0803-04-3AE11-A | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0803 | Bulk | Active | 0°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | download | ROHS3 Compliant | Not Applicable | 1686-TE0803-04-3AE11-A | 1 | Zynq UltraScale+ XCZU3CG-1SFVC784E | - | 2GB | 128MB | MPU Core | - | B2B | ||||
|
Trenz Electronic GmbH 0803-04-4AE11-A | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0803 | Bulk | Active | 0°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | download | ROHS3 Compliant | Not Applicable | 1686-TE0803-04-4AE11-A | 1 | Zynq UltraScale+ XCZU4CG-1SFVC784E | - | 2GB | 128MB | MPU Core | - | B2B | ||||
|
Trenz Electronic GmbH 0803-04-5DI21-A | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0803 | Bulk | Active | -40°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | download | ROHS3 Compliant | Not Applicable | 1686-TE0803-04-5DI21-A | 1 | Zynq UltraScale+ XCZU5EV-1SFVC784I | - | 4GB | 128MB | MPU Core | - | B2B | ||||
| Trenz Electronic GmbH 0813-01-4BE11-A | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | - | Box | Active | 0°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | download | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0813-01-4BE11-A | EAR99 | 8538.90.8180 | 1 | Xilinx Zynq UltraScale+ XCZU4EG-1SFVC784E | - | 2GB | 128MB | FPGA Core | - | Board-to-Board (BTB) Socket | |||
|
Trenz Electronic GmbH 0741-04-G2C-1-A | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | - | Box | Active | 0°C ~ 70°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0741-04-G2C-1-A | 1 | Xilinx Kintex-7 FPGA XC7K410T-2FBG676C | - | - | 32MB | FPGA Core | - | Board-to-Board (BTB) Socket | ||||
|
Trenz Electronic GmbH 0741-04-B3E-1-AF | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | * | Box | Active | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0741-04-B3E-1-AF | 1 | ||||||||||||||
|
Trenz Electronic GmbH 0808-05-BBE21-AZ | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | - | Box | Active | 0°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | download | ROHS3 Compliant | 1 (Unlimited) | 1 | Xilinx Zynq UltraScale+ XCZU2CG-1SFVC784E | - | 2GB | 128MB | FPGA Core | - | Board-to-Board (BTB) Socket | |||||
|
Trenz Electronic GmbH 0741-04-A2C-1-A | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | - | Box | Active | 0°C ~ 70°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0741-04-A2C-1-A | 1 | Xilinx Kintex-7 FPGA XC7K70T-2FBG676C | - | - | 32MB | FPGA Core | - | Board-to-Board (BTB) Socket | ||||
|
Trenz Electronic GmbH 0741-04-B2C-1-AF | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | - | Box | Active | 0°C ~ 70°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0741-04-B2C-1-AF | 1 | Xilinx Kintex-7 FPGA XC7K160T-2FFG676C | - | - | 32MB | FPGA Core | - | Board-to-Board (BTB) Socket | ||||
|
Trenz Electronic GmbH S00014 | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | * | Box | Obsolete | ROHS3 Compliant | 1 (Unlimited) | 1686-S00014 | OBSOLETE | 1 | |||||||||||||
|
Trenz Electronic GmbH 0720-03-S003C1 | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0720 | Bulk | Discontinued at Digi-Key | - | - | download | ROHS3 Compliant | Not Applicable | 1686-TE0720-03-S003C1 | 1 | - | - | - | 8GB | MCU, FPGA | Zynq-7000 (Z-7020) | - | ||||
|
Trenz Electronic GmbH 0720-03-S002 | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0720 | Bulk | Obsolete | - | - | Not Applicable | 1686-TE0720-03-S002 | OBSOLETE | 1 | - | - | - | 8GB | MCU, FPGA | Zynq-7000 (Z-7020) | - | |||||
| Trenz Electronic GmbH 0720-03-62I33MA | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0720 | Bulk | Discontinued at Digi-Key | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | ROHS3 Compliant | Not Applicable | 1686-TE0720-03-62I33MA | EAR99 | 8473.30.1180 | 1 | ARM Cortex-A9 | - | 1GB | 8GB | MCU, FPGA | Zynq-7000 (Z-7020) | Samtec LSHM | |||
| Trenz Electronic GmbH 0720-03-61Q33ML | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0720 | Bulk | Discontinued at Digi-Key | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | ROHS3 Compliant | Not Applicable | 1686-TE0720-03-61Q33ML | 1 | ARM Cortex-A9 | - | 1GB | 8GB | MCU, FPGA | Zynq-7000 (Z-7020) | Samtec LSHM |
In Stock
Please send RFQ , we will respond immediately.
- English
- French
- German
- Portuguese
- Spanish
- Russian
- Japanese
- Korean
- Arabic
- Irish
- Greek
- Turkish
- Italian
- Danish
- Romanian
- Indonesian
- Czech
- Afrikaans
- Swedish
- Polish
- Basque
- Catalan
- Esperanto
- Hindi
- Lao
- Albanian
- Amharic
- Armenian
- Azerbaijani
- Belarusian
- Bengali
- Bosnian
- Bulgarian
- Cebuano
- Chichewa
- Corsican
- Croatian
- Dutch
- Estonian
- Filipino
- Finnish
- Frisian
- Galician
- Georgian
- Gujarati
- Haitian
- Hausa
- Hawaiian
- Hebrew
- Hmong
- Hungarian
- Icelandic
- Igbo
- Javanese
- Kannada
- Kazakh
- Khmer
- Kurdish
- Kyrgyz
- Latin
- Latvian
- Lithuanian
- Luxembou..
- Macedonian
- Malagasy
- Malay
- Malayalam
- Maltese
- Maori
- Marathi
- Mongolian
- Burmese
- Nepali
- Norwegian
- Pashto
- Persian
- Punjabi
- Serbian
- Sesotho
- Sinhala
- Slovak
- Slovenian
- Somali
- Samoan
- Scots Gaelic
- Shona
- Sindhi
- Sundanese
- Swahili
- Tajik
- Tamil
- Telugu
- Thai
- Ukrainian
- Urdu
- Uzbek
- Vietnamese
- Welsh
- Xhosa
- Yiddish
- Yoruba
- Zulu
- Kinyarwanda
- Tatar
- Oriya
- Turkmen
- Uyghur