| Compare | Image | Name | Manufacturer | Quantity | Mfr | Series | Package | Product Status | Operating Temperature | Size / Dimension | Base Product Number | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Core Processor | Speed | RAM Size | Flash Size | Module/Board Type | Co-Processor | Connector Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Trenz Electronic GmbH S00005 | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | - | Bulk | Obsolete | ROHS3 Compliant | Not Applicable | 1686-S00005 | OBSOLETE | 1 | ||||||||||||||
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Trenz Electronic GmbH 0745-02-93E11-KA | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0745 | Bulk | Obsolete | -40°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | ROHS3 Compliant | Not Applicable | 1686-TE0745-02-93E11-KA | OBSOLETE | 1 | ARM Cortex-A9 | - | 1GB | 64MB | MCU, FPGA | Zynq-7000 (Z-7045) | Board-to-Board (BTB) Socket - 480 | |||||
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Trenz Electronic GmbH 0782-02-A2I33FA | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0782 | Bulk | Discontinued at Digi-Key | -40°C ~ 85°C | 3.350" L x 3.350" W (85.00mm x 85.00mm) | download | ROHS3 Compliant | Not Applicable | 1686-TE0782-02-A2I33FA | 1 | ARM Cortex-A9 | - | 1GB | 32MB | MCU, FPGA | Zynq-7000 (Z-7100) | Board-to-Board (BTB) Socket - 480 | |||||
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Trenz Electronic GmbH 0782-02-82I33FA | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0782 | Bulk | Discontinued at Digi-Key | -40°C ~ 85°C | 3.350" L x 3.350" W (85.00mm x 85.00mm) | download | ROHS3 Compliant | Not Applicable | 1686-TE0782-02-82I33FA | 1 | ARM Cortex-A9 | - | 1GB | 32MB | MCU, FPGA | Zynq-7000 (Z-7035) | Board-to-Board (BTB) Socket - 480 | |||||
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Trenz Electronic GmbH 0782-02-92I33FH | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0782 | Bulk | Active | -40°C ~ 85°C | 3.350" L x 3.350" W (85.00mm x 85.00mm) | download | ROHS3 Compliant | Not Applicable | 1686-TE0782-02-92I33FH | 1 | ARM Cortex-A9 | - | 1GB | 32MB | MCU, FPGA | Zynq-7000 (Z-7045) | Board-to-Board (BTB) Socket - 480 | |||||
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Trenz Electronic GmbH 0714-03-35-2I3 | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0714 | Bulk | Last Time Buy | -40°C ~ 85°C | 1.570" L x 1.180" W (40.00mm x 30.00mm) | 1686-TE0714-03-35-2I3 | 1 | Artix-7 A35T | - | - | 16MB | FPGA | Artix-7 | - | ||||||||
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Trenz Electronic GmbH 0714-04-42I-7-B | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0714 | Bulk | Active | -40°C ~ 85°C | 1.570" L x 1.180" W (40.00mm x 30.00mm) | 1686-TE0714-04-42I-7-B | 1 | Artix-7 A35T | - | - | 16MB | FPGA | Artix-7 | - | ||||||||
| Trenz Electronic GmbH 0600-03BM | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0600 | Bulk | Obsolete | 0°C ~ 70°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | TE0600 | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 3A991D | 8471.50.0150 | 1 | Spartan-6 LX-100 | 125MHz | 1GB | 16MB | FPGA Core | - | Samtec LSHM | |||
| Trenz Electronic GmbH 0600-03IVFN | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0600 | Bulk | Active | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | TE0600 | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 3A991D | 8471.50.0150 | 1 | Spartan-6 LX-150 | 125MHz | 256MB | 16MB | FPGA Core | - | Samtec LSHM | |||
| Trenz Electronic GmbH 0720-03-14S-1C | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0720 | Bulk | Obsolete | 0°C ~ 70°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | TE0720 | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 1686-1093 | EAR99 | 8471.50.0150 | 1 | ARM Cortex-A9 | 766MHz | 1GB | 32MB | MCU, FPGA | Zynq-7000 (Z-7014S) | Samtec LSHM | ||
| Trenz Electronic GmbH 0726-03-07S-1C | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0726 | Bulk | Obsolete | 0°C ~ 70°C | 1.570" L x 1.180" W (40.00mm x 30.00mm) | TE0726 | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 1686-1094 | 3A991D | 8471.50.0150 | 1 | ARM Cortex-A9 | 766MHz | 512MB | 16MB | MCU, FPGA | Zynq-7000 (Z-7007S) | CSI, DSI | ||
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Trenz Electronic GmbH 0803-03-2AE11-A | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0803 | Bulk | Obsolete | 0°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | TE0803 | download | ROHS3 Compliant | Not Applicable | 5A002A TRE | 8471.50.0150 | 1 | Zynq UltraScale+ XCZU2CG-1SFVC784E | - | 2GB | 128MB | MPU Core | - | B2B | |||
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Trenz Electronic GmbH 0630-02IBF | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0630 | Bulk | Active | -40°C ~ 85°C | 1.600" L x 1.900" W (40.50mm x 47.50mm) | TE0630 | ROHS3 Compliant | Not Applicable | 0000.00.0000 | 1 | Spartan-6 LX-75 | 100MHz | 128MB | 8MB | FPGA, USB Core | Cypress EZ-USB FX2LP | B2B | |||||
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Trenz Electronic GmbH 0630-02IV | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0630 | Bulk | Active | -40°C ~ 85°C | 1.600" L x 1.900" W (40.50mm x 47.50mm) | TE0630 | ROHS3 Compliant | Not Applicable | 0000.00.0000 | 1 | Spartan-6 LX-150 | 100MHz | 128MB | 8MB | FPGA, USB Core | Cypress EZ-USB FX2LP | B2B | |||||
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Trenz Electronic GmbH 0807-02-04EG-1E | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | * | Bulk | Obsolete | download | Not Applicable | 1686-TE0807-02-04EG-1E | OBSOLETE | 1 | ||||||||||||||
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Trenz Electronic GmbH 0803-02-04EV-1E3 | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0803 | Bulk | Obsolete | 0°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | Not Applicable | 1686-TE0803-02-04EV-1E3 | OBSOLETE | 1 | Zynq UltraScale+ XCZU4EV-1SFVC784E | - | 2GB | 128MB | MPU Core | - | B2B | ||||||
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Trenz Electronic GmbH 0803-02-02EG-1EA | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0803 | Bulk | Obsolete | 0°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | Not Applicable | 1686-TE0803-02-02EG-1EA | OBSOLETE | 1 | Zynq UltraScale+ XCZU2EG-1SFVC784E | - | 2GB | 128MB | MPU Core | - | B2B | ||||||
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Trenz Electronic GmbH 0803-02-03CG-1EA | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0803 | Bulk | Obsolete | - | 2.050" L x 2.990" W (52.00mm x 76.00mm) | Not Applicable | 1686-TE0803-02-03CG-1EA | OBSOLETE | 1 | - | - | - | - | MPU Core | - | B2B | ||||||
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Trenz Electronic GmbH 0803-03-5DI21-A | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | * | Bulk | Obsolete | TE0803 | download | ROHS3 Compliant | Not Applicable | 1686-TE0803-03-5DI21-A | OBSOLETE | 1 | ||||||||||||
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Trenz Electronic GmbH 0803-03-4BE21-L | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | * | Bulk | Active | TE0803 | ROHS3 Compliant | Not Applicable | 1686-TE0803-03-4BE21-L | 1 | ||||||||||||||
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Trenz Electronic GmbH 0803-02-05EV-1EA | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0803 | Bulk | Obsolete | 0°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | Not Applicable | 1686-TE0803-02-05EV-1EA | OBSOLETE | 1 | Zynq UltraScale+ XCZU5EV-1SFVC784E | - | 2GB | 128MB | MPU Core | - | B2B | ||||||
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Trenz Electronic GmbH 0725LP-01-72C-1U | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0725 | Bulk | Active | 0°C ~ 70°C | 2.870" L x 1.380" W (73.00mm x 35.00mm) | TE0725 | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0725LP-01-72C-1U | 1 | Artix-7 A100T | 25MHz | - | 64MB | FPGA Core | - | 50 Pin | |||||
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Trenz Electronic GmbH 0820-03-2AI21FA | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0820 | Bulk | Obsolete | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | 1 (Unlimited) | 1686-TE0820-03-2AI21FA | OBSOLETE | 1 | Zynq UltraScale+ XCZU2CG-1SFVC784I | - | 2GB | 128MB | MPU Core | - | Samtec LSHM | |||||
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Trenz Electronic GmbH 0820-03-03EG-1EL | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0820 | Bulk | Obsolete | 0°C ~ 85°C | 1.570" L x 1.970" W (40.00mm x 50.00mm) | download | 1 (Unlimited) | 1686-TE0820-03-03EG-1EL | OBSOLETE | 1 | Zynq UltraScale+ XCZU3EG-1SFVC784E | - | 2GB | 128MB | MPU Core | - | B2B | |||||
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Trenz Electronic GmbH 0820-03-2BE21FA | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | * | Bulk | Obsolete | download | 1 (Unlimited) | 1686-TE0820-03-2BE21FA | OBSOLETE | 1 | ||||||||||||||
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Trenz Electronic GmbH 0820-03-3AE21FA | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | * | Bulk | Obsolete | download | 1 (Unlimited) | 1686-TE0820-03-3AE21FA | OBSOLETE | 1 | ||||||||||||||
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Trenz Electronic GmbH 0820-03-2BE21FL | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0820 | Bulk | Obsolete | 0°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | 1 (Unlimited) | 1686-TE0820-03-2BE21FL | OBSOLETE | 1 | Zynq UltraScale+ XCZU2EG-1SFVC784E | - | 2GB | 128MB | MPU Core | - | Samtec LSHM | |||||
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Trenz Electronic GmbH 0841-02-41I21-A | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0841 | Bulk | Active | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | TE0841 | download | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0841-02-41I21-A | 3A991D | 8471.50.0150 | 1 | Kintex UltraScale KU40 | - | 2GB | 64MB | MCU, FPGA | - | B2B | ||
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Trenz Electronic GmbH 0841-02-41C21-A | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0841 | Bulk | Active | 0°C ~ 70°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | TE0841 | download | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0841-02-41C21-A | 3A991D | 8471.50.0150 | 1 | Kintex UltraScale KU40 | - | 2GB | 64MB | MCU, FPGA | - | B2B | ||
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Trenz Electronic GmbH 0841-02-0401IL | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0841 | Bulk | Obsolete | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | ROHS3 Compliant | Not Applicable | 1686-TE0841-02-0401IL | OBSOLETE | 1 | Kintex UltraScale KU40 | - | 2GB | 64MB | MCU, FPGA | - | B2B |
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