| Compare | Image | Name | Manufacturer | Quantity | Mfr | Series | Package | Product Status | Operating Temperature | Size / Dimension | Base Product Number | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | Other Names | ECCN | HTSUS | Standard Package | Core Processor | Speed | RAM Size | Flash Size | Module/Board Type | Co-Processor | Connector Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Trenz Electronic GmbH 0841-02-41I21-L | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0841 | Bulk | Active | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | TE0841 | download | ROHS3 Compliant | Not Applicable | 1686-TE0841-02-41I21-L | 3A991D | 8471.50.0150 | 1 | Kintex UltraScale KU040 | - | 2GB | 64MB | FPGA Core | - | B2B | |
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Trenz Electronic GmbH C0850-03-BBEX1-A | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | * | Bulk | Active | TEC0850 | ROHS3 Compliant | Not Applicable | 1686-TEC0850-03-BBEX1-A | 1 | |||||||||||||
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Trenz Electronic GmbH 0808-04-9GI21-A | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0808 | Bulk | Obsolete | -40°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | TE0808 | download | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0808-04-9GI21-A | 5A002A TRE | 8473.30.1180 | 1 | Zynq UltraScale+ XCZU9EG-2FFVC900I | - | 4GB | 128MB | MPU Core | - | B2B | |
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Trenz Electronic GmbH 0808-04-9GI21-AS | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0808 | Box | Obsolete | -40°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | TE0808 | download | ROHS3 Compliant | Not Applicable | 1686-TE0808-04-9GI21-AS | OBSOLETE | 1 | Zynq UltraScale+ ZU9 | - | 4GB | 128MB | FPGA Core | - | B2B | ||
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Trenz Electronic GmbH 0745-02-92I11-A | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | - | Bulk | Obsolete | - | - | TE0745 | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0745-02-92I11-A | 3A991D | 8471.50.0150 | 1 | - | - | - | - | - | - | |||
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Trenz Electronic GmbH 0808-04-BBE21-A | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0808 | Bulk | Active | 0°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | TE0808 | download | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0808-04-BBE21-A | 1 | Zynq UltraScale+ XCZU15EG-1FFVC900E | - | 4GB | 128MB | MPU Core | - | B2B | |||
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Trenz Electronic GmbH 0745-02-91C11-A | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0745 | Bulk | Obsolete | 0°C ~ 70°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | TE0745 | download | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0745-02-91C11-A | OBSOLETE | 1 | Xilinx Zynq XC7Z045-1FBG676C | - | 1GB | 64MB | MPU Core | - | Samtec ST5 | ||
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Trenz Electronic GmbH 0745-02-72I11-A | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0745 | Bulk | Obsolete | -40°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | TE0745 | download | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0745-02-72I11-A | 3A991D | 8471.50.0150 | 1 | Xilinx Zynq XC7Z030-2FBG676I | - | 1GB | 64MB | MPU Core | - | Samtec ST5 | |
| Trenz Electronic GmbH 0720-03-61Q33MA | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0720 | Bulk | Discontinued at Digi-Key | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | ROHS3 Compliant | Not Applicable | 1686-TE0720-03-61Q33MA | EAR99 | 8473.30.1180 | 1 | ARM Cortex-A9 | - | 1GB | 8GB | MCU, FPGA | Zynq-7000 (Z-7020) | Samtec LSHM | |||
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Trenz Electronic GmbH 0720-03-S007C1 | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0720 | Bulk | Discontinued at Digi-Key | - | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | ROHS3 Compliant | Not Applicable | 1686-TE0720-03-S007C1 | 1 | ARM Cortex-A9 | - | - | 8GB | MCU, FPGA | Zynq-7000 (Z-7020) | Samtec LSHM | ||||
| Trenz Electronic GmbH 0720-03-62I33MAN | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0720 | Bulk | Discontinued at Digi-Key | 0°C ~ 70°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | ROHS3 Compliant | Not Applicable | 1686-TE0720-03-62I33MAN | 1 | ARM Cortex-A9 | - | 1GB | 8GB | MCU, FPGA | Zynq-7000 (Z-7020) | Samtec LSHM | |||||
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Trenz Electronic GmbH 0720-03-S008C1 | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0720 | Bulk | Discontinued at Digi-Key | - | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | ROHS3 Compliant | Not Applicable | 1686-TE0720-03-S008C1 | 1 | ARM Cortex-A9 | - | - | 8GB | MCU, FPGA | Zynq-7000 (Z-7020) | Samtec LSHM | ||||
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Trenz Electronic GmbH 0720-03-S005 | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0720 | Bulk | Discontinued at Digi-Key | - | - | download | ROHS3 Compliant | Not Applicable | 1686-TE0720-03-S005 | 1 | - | - | - | 8GB | MCU, FPGA | Zynq-7000 (Z-7020) | - | ||||
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Trenz Electronic GmbH 0720-03-61Q33FAG | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0720 | Bulk | Obsolete | - | - | Not Applicable | 1686-TE0720-03-61Q33FAG | OBSOLETE | 1 | - | - | - | 8GB | MCU, FPGA | Zynq-7000 (Z-7020) | - | |||||
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Trenz Electronic GmbH 0720-03-S004 | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0720 | Bulk | Discontinued at Digi-Key | - | - | download | ROHS3 Compliant | Not Applicable | 1686-TE0720-03-S004 | 1 | - | - | - | 8GB | MCU, FPGA | Zynq-7000 (Z-7020) | - | ||||
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Trenz Electronic GmbH 0729-02-62I65MM | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | - | Bulk | Active | download | ROHS3 Compliant | Not Applicable | 1686-TE0729-02-62I65MM | 1 | |||||||||||||
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Trenz Electronic GmbH 0729-02-62I63MAK | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0729 | Bulk | Active | -40°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | download | ROHS3 Compliant | Not Applicable | 1686-TE0729-02-62I63MAK | 3A991D | 8471.50.0150 | 1 | ARM Cortex-A9 | - | 512MB | 32MB | MCU, FPGA | Zynq-7000 (Z-7020) | B2B | ||
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Trenz Electronic GmbH 0820-04-40121FA | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0820 | Bulk | Obsolete | - | - | download | ROHS3 Compliant | Not Applicable | 1686-TE0820-04-40121FA | OBSOLETE | 1 | - | - | - | - | - | - | ||||
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Trenz Electronic GmbH 0820-04-4AI21FL | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0820 | Bulk | Obsolete | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | TE0820 | download | ROHS3 Compliant | Not Applicable | 1686-TE0820-04-4AI21FL | OBSOLETE | 1 | Zynq UltraScale+ XCZU4CG-1SFVC784I | - | 2GB | 128MB | MPU Core | - | Samtec LSHM | ||
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Trenz Electronic GmbH 0820-04-2BI21FA | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0820 | Bulk | Obsolete | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | TE0820 | download | ROHS3 Compliant | Not Applicable | 1686-TE0820-04-2BI21FA | OBSOLETE | 1 | Zynq UltraScale+ XCZU2EG-1SFVC784I | - | 2GB | 128MB | MPU Core | - | Samtec LSHM | ||
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Trenz Electronic GmbH 0820-04-4B121PL | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0820 | Bulk | Active | - | - | download | ROHS3 Compliant | Not Applicable | 1686-TE0820-04-4B121PL | 1 | - | - | - | - | - | - | |||||
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Trenz Electronic GmbH 0823-01-3PIU1F | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0823 | Bulk | Obsolete | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | 1686-TE0823-01-3PIU1F | OBSOLETE | 1 | ARM Cortex-A53, ARM® Cortex®-R5 | - | 1GB | 128MB | MCU, FPGA | Xilinx Zynq UltraScale+ XCZU3CG-L1SFVC784I | USB | |||||
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Trenz Electronic GmbH 0823-01-3PIU1ML | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0823 | Bulk | Active | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | 1686-TE0823-01-3PIU1ML | 1 | ARM Cortex-A53, ARM® Cortex®-R5 | - | 1GB | 128MB | MCU, FPGA | Xilinx Zynq UltraScale+ XCZU3CG-L1SFVC784I | USB | ||||||
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Trenz Electronic GmbH 0782-02-A2I33MA | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0782 | Bulk | Active | -40°C ~ 85°C | 3.350" L x 3.350" W (85.00mm x 85.00mm) | download | Not Applicable | 1686-TE0782-02-A2I33MA | 1 | ARM Cortex-A9 | - | 1GB | 32MB | MCU, FPGA | Zynq-7000 (Z-7100) | Board-to-Board (BTB) Socket | |||||
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Trenz Electronic GmbH 0782-02-92I33MA | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0782 | Bulk | Active | -40°C ~ 85°C | 3.350" L x 3.350" W (85.00mm x 85.00mm) | download | Not Applicable | 1686-TE0782-02-92I33MA | 1 | ARM Cortex-A9 | - | 1GB | 32MB | MCU, FPGA | Zynq-7000 (Z-7045) | Board-to-Board (BTB) Socket | |||||
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Trenz Electronic GmbH 0808-05-9BE21-A | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | - | Bulk | Active | 0°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | download | 1 (Unlimited) | 1686-TE0808-05-9BE21-A | 5A002A TRE | 8471.50.0150 | 1 | Zynq UltraScale+ XCZU9EG-1FFVC900E | - | 4GB | 128MB | MPU Core | - | B2B | |||
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Trenz Electronic GmbH 0741-04-B2I-1-A | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | - | Box | Active | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0741-04-B2I-1-A | 1 | Xilinx Kintex-7 FPGA XC7K160T-2FBG676I | - | - | 32MB | FPGA Core | - | Board-to-Board (BTB) Socket | ||||
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Trenz Electronic GmbH 0741-03-410-2IF | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | - | Box | Obsolete | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0741-03-410-2IF | OBSOLETE | 1 | Xilinx Kintex-7 FPGA XC7K410T-2FBG676I | - | - | 32MB | FPGA Core | - | Board-to-Board (BTB) Socket | |||
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Trenz Electronic GmbH 0741-04-D2C-1-A | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | - | Box | Active | 0°C ~ 70°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0741-04-D2C-1-A | 1 | Xilinx Kintex-7 FPGA XC7K325T-2FBG676C | - | - | 32MB | FPGA Core | - | Board-to-Board (BTB) Socket | ||||
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Trenz Electronic GmbH 0741-04-D2I-1-A | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | - | Box | Active | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0741-04-D2I-1-A | 1 | Xilinx Kintex-7 FPGA XC7K325T-2FBG676I | - | - | 32MB | FPGA Core | - | Board-to-Board (BTB) Socket |
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