| Compare | Image | Name | Manufacturer | Quantity | Mfr | Series | Package | Product Status | Operating Temperature | Applications | Mounting Type | Package / Case | Type | Features | Base Product Number | Current - Supply | Output Type | Number of Circuits | Voltage - Supply | Supplier Device Package | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Number of I/O | Core Processor | Core Size | Speed | Connectivity | Peripherals | Program Memory Size | Program Memory Type | EEPROM Size | RAM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Protocol | Number of Drivers/Receivers | Duplex | Receiver Hysteresis | Data Rate | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | SATA | USB | Voltage - I/O | Security Features | Additional Interfaces | Input Signal | Output Signal | Translator Type | Channel Type | Channels per Circuit | Voltage - VCCA | Voltage - VCCB |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| NXP USA Inc. MC35FS4502NAER2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Automotive, AEC-Q100 | Tape & Reel (TR) | Active | -40°C ~ 150°C (TA) | System Basis Chip | Surface Mount | 48-LQFP Exposed Pad | MC35FS4502 | - | 1V ~ 5V | 48-HLQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935360443528 | EAR99 | 8542.39.0001 | 2,000 | ||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MC35FS4503NAER2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Automotive, AEC-Q100 | Tape & Reel (TR) | Active | -40°C ~ 150°C (TA) | System Basis Chip | Surface Mount | 48-LQFP Exposed Pad | MC35FS4503 | - | 1V ~ 5V | 48-HLQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935360447528 | EAR99 | 8542.39.0001 | 2,000 | ||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MC35FS6500NAER2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Automotive, AEC-Q100 | Tape & Reel (TR) | Active | -40°C ~ 150°C (TA) | System Basis Chip | Surface Mount | 48-LQFP Exposed Pad | MC35FS6500 | - | 1V ~ 5V | 48-HLQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935360707528 | EAR99 | 8542.39.0001 | 2,000 | ||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MC35FS6501NAE | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Automotive, AEC-Q100 | Tray | Active | -40°C ~ 150°C (TA) | System Basis Chip | Surface Mount | 48-LQFP Exposed Pad | MC35FS6501 | - | 1V ~ 5V | 48-HLQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935362502557 | EAR99 | 8542.39.0001 | 250 | ||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MC35FS6502CAE | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Automotive, AEC-Q100 | Tray | Active | -40°C ~ 150°C (TA) | System Basis Chip | Surface Mount | 48-LQFP Exposed Pad | MC35FS6502 | - | 1V ~ 5V | 48-HLQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935360709557 | EAR99 | 8542.39.0001 | 250 | ||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MC35FS6502NAE | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Automotive, AEC-Q100 | Tray | Active | -40°C ~ 150°C (TA) | System Basis Chip | Surface Mount | 48-LQFP Exposed Pad | MC35FS6502 | - | 1V ~ 5V | 48-HLQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935360592557 | EAR99 | 8542.39.0001 | 250 | ||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MC35FS6502NAER2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Automotive, AEC-Q100 | Tape & Reel (TR) | Active | -40°C ~ 150°C (TA) | System Basis Chip | Surface Mount | 48-LQFP Exposed Pad | MC35FS6502 | - | 1V ~ 5V | 48-HLQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935360592528 | EAR99 | 8542.39.0001 | 2,000 | ||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MC35FS6503CAE | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Automotive, AEC-Q100 | Tray | Active | -40°C ~ 150°C (TA) | System Basis Chip | Surface Mount | 48-LQFP Exposed Pad | MC35FS6503 | - | 1V ~ 5V | 48-HLQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935360594557 | EAR99 | 8542.39.0001 | 250 | ||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MC35FS6503NAE | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Automotive, AEC-Q100 | Tray | Active | -40°C ~ 150°C (TA) | System Basis Chip | Surface Mount | 48-LQFP Exposed Pad | MC35FS6503 | - | 1V ~ 5V | 48-HLQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935360596557 | EAR99 | 8542.39.0001 | 250 | ||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MC35FS6503NAER2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Automotive, AEC-Q100 | Tape & Reel (TR) | Active | -40°C ~ 150°C (TA) | System Basis Chip | Surface Mount | 48-LQFP Exposed Pad | MC35FS6503 | - | 1V ~ 5V | 48-HLQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935360596528 | EAR99 | 8542.39.0001 | 2,000 | ||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MC35FS6510CAER2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Automotive, AEC-Q100 | Tape & Reel (TR) | Active | -40°C ~ 150°C (TA) | System Basis Chip | Surface Mount | 48-LQFP Exposed Pad | MC35FS6510 | - | 1V ~ 5V | 48-HLQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935360598528 | EAR99 | 8542.39.0001 | 2,000 | ||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MC35FS6511CAE | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Automotive, AEC-Q100 | Tray | Active | -40°C ~ 150°C (TA) | System Basis Chip | Surface Mount | 48-LQFP Exposed Pad | MC35FS6511 | - | 1V ~ 5V | 48-HLQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935360607557 | EAR99 | 8542.39.0001 | 250 | ||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MC35FS6511NAE | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Automotive, AEC-Q100 | Tray | Active | -40°C ~ 150°C (TA) | System Basis Chip | Surface Mount | 48-LQFP Exposed Pad | MC35FS6511 | - | 1V ~ 5V | 48-HLQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935360609557 | EAR99 | 8542.39.0001 | 250 | ||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MC35FS6512CAE | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Automotive, AEC-Q100 | Tray | Active | -40°C ~ 150°C (TA) | System Basis Chip | Surface Mount | 48-LQFP Exposed Pad | MC35FS6512 | - | 1V ~ 5V | 48-HLQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935360612557 | EAR99 | 8542.39.0001 | 250 | ||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MC35FS6513NAE | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Automotive, AEC-Q100 | Tray | Active | -40°C ~ 150°C (TA) | System Basis Chip | Surface Mount | 48-LQFP Exposed Pad | MC35FS6513 | - | 1V ~ 5V | 48-HLQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935360438557 | EAR99 | 8542.39.0001 | 250 | ||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MCIMX6S7CVM08ADR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6S | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 624-LFBGA | MCIMX6 | 624-MAPBGA (21x21) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935354192518 | 5A992C | 8542.31.0001 | 500 | ARM® Cortex®-A9 | 800MHz | 1 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000Mbps (1) | - | USB 2.0 + PHY (4) | 1.8V, 2.5V, 2.8V, 3.3V | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | CAN, I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, UART | ||||||||||||||||||||||||||||||||
| NXP USA Inc. MCIMX6U5DVM10AD | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6DL | Tray | Active | 0°C ~ 95°C (TJ) | Surface Mount | 624-LFBGA | MCIMX6 | 624-MAPBGA (21x21) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935360464557 | 5A992C | 8542.31.0001 | 60 | ARM® Cortex®-A9 | 1.0GHz | 2 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000Mbps (1) | - | USB 2.0 + PHY (4) | 1.8V, 2.5V, 2.8V, 3.3V | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | CAN, I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, UART | ||||||||||||||||||||||||||||||||
| NXP USA Inc. MCIMX6U6AVM10ACR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6DL | Tape & Reel (TR) | Active | -40°C ~ 125°C (TJ) | Surface Mount | 624-LFBGA | MCIMX6 | 624-MAPBGA (21x21) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935332959518 | 5A002A1 | 8542.31.0001 | 500 | ARM® Cortex®-A9 | 1GHz | 2 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000Mbps (1) | - | USB 2.0 + PHY (4) | 1.8V, 2.5V, 2.8V, 3.3V | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | CAN, I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, UART | ||||||||||||||||||||||||||||||||
| NXP USA Inc. MK22FN512VLL12R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K20 | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 100-LQFP | MK22FN512 | 100-LQFP (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935312058528 | 3A991A2 | 8542.31.0001 | 1,000 | 66 | ARM® Cortex®-M4 | 32-Bit Single-Core | 120MHz | I²C, IrDA, SPI, UART/USART, USB, USB OTG | DMA, I²S, LVD, POR, PWM, WDT | 512KB (512K x 8) | FLASH | - | 128K x 8 | 1.71V ~ 3.6V | A/D 33x16b; D/A 2x12b | Internal | ||||||||||||||||||||||||||||||||
| NXP USA Inc. MKL26Z128VFT4R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis KL2 | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 48-VFQFN Exposed Pad | MKL26Z128 | 48-QFN (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935324624528 | 3A991A2 | 8542.31.0001 | 2,000 | 36 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 48MHz | I²C, LINbus, SPI, UART/USART, USB, USB OTG | Brown-out Detect/Reset, DMA, I²S, LVD, POR, PWM, WDT | 128KB (128K x 8) | FLASH | - | 16K x 8 | 1.71V ~ 3.6V | A/D - 16bit; D/A - 12bit | Internal | ||||||||||||||||||||||||||||||||
| NXP USA Inc. MC9S08QL8CTJ | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tube | Active | -40°C ~ 85°C (TA) | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | MC9S08 | 20-TSSOP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.31.0001 | 75 | 18 | S08 | 8-Bit | 20MHz | LINbus, SCI | LVD, PWM, WDT | 8KB (8K x 8) | FLASH | - | 8K x 8 | 1.8V ~ 3.6V | A/D 8x12b | Internal | |||||||||||||||||||||||||||||||||
| NXP USA Inc. MC9S08QL8CTG | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tube | Active | -40°C ~ 85°C (TA) | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | MC9S08 | 16-TSSOP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.31.0001 | 96 | 14 | S08 | 8-Bit | 20MHz | LINbus, SCI | LVD, PWM, WDT | 8KB (8K x 8) | FLASH | - | 8K x 8 | 1.8V ~ 3.6V | A/D 8x12b | Internal | |||||||||||||||||||||||||||||||||
| NXP USA Inc. S912ZVMAL3F0MLC | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S12 MagniV | Tray | Active | -40°C ~ 125°C (TA) | Surface Mount | 32-LQFP | S912 | 32-LQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 1,250 | 10 | S12Z | 16-Bit | 32MHz | LINbus, SCI, SPI | PWM, WDT | 32KB (32K x 8) | FLASH | 128 x 8 | 2K x 8 | 3.5V ~ 20V | A/D 4x10b | Internal | |||||||||||||||||||||||||||||||||
| NXP USA Inc. NTB0101GS1Z | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Obsolete | -40°C ~ 125°C (TA) | Surface Mount | 6-XFDFN | - | NTB0101 | Tri-State, Non-Inverted | 1 | 6-X2SON (1x1) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8542.39.0001 | 10,000 | 100Mbps | - | - | Voltage Level | Bidirectional | 1 | 1.2 V ~ 3.6 V | 1.65 V ~ 5.5 V | |||||||||||||||||||||||||||||||||||
| NXP USA Inc. TJA1128CTK/0Z | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Automotive, AEC-Q100 | Tape & Reel (TR) | Active | -40°C ~ 150°C (TJ) | Surface Mount | 14-VDFN Exposed Pad | Transceiver | TJA1128 | 5V ~ 28V | 14-HVSON (3x4.5) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8542.39.0001 | 6,000 | LIN | 1/1 | Full | 20kBd | ||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. TJA1128DTK/0Z | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Automotive, AEC-Q100 | Tape & Reel (TR) | Active | -40°C ~ 150°C (TJ) | Surface Mount | 14-VDFN Exposed Pad | Transceiver | TJA1128 | 5V ~ 28V | 14-HVSON (3x4.5) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8542.39.0001 | 6,000 | LIN | 1/1 | Full | 20kBd | ||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. TJA1128GTK/0Z | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Automotive, AEC-Q100 | Tape & Reel (TR) | Active | -40°C ~ 150°C (TJ) | Surface Mount | 14-VDFN Exposed Pad | Transceiver | TJA1128 | 5V ~ 28V | 14-HVSON (3x4.5) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8542.39.0001 | 6,000 | LIN | 1/1 | Full | 20kBd | ||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. TJA1044VT/3Z | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Automotive, AEC-Q100 | Tape & Reel (TR) | Active | -40°C ~ 150°C (TJ) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | Transceiver | TJA1044 | 4.75V ~ 5.25V | 8-SO | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8542.39.0001 | 2,500 | CANbus | 1/1 | Half | 300 mV | 5Mbps | |||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MIMX8MM6DVTLZAA | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX8MM | Tray | Active | 0°C ~ 95°C (TJ) | Surface Mount | 486-LFBGA, FCBGA | MIMX8MM6 | 486-LFBGA (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 152 | ARM® Cortex®-A53 | 1.8GHz | 4 Core, 64-Bit | ARM® Cortex®-M4 | DDR3L, DDR4, LPDDR4 | Yes | MIPI-DSI | GbE | - | USB 2.0 + PHY (2) | - | ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS | I²C, PCIe, SDHC, SPI, UART | |||||||||||||||||||||||||||||||||
| NXP USA Inc. MIMX8MM6CVTKZAA | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX8MM | Tray | Active | -40°C ~ 105°C (TJ) | Surface Mount | 486-LFBGA, FCBGA | MIMX8 | 486-LFBGA (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 152 | ARM® Cortex®-A53 | 1.6GHz | 4 Core, 64-Bit | ARM® Cortex®-M4 | DDR3L, DDR4, LPDDR4 | Yes | MIPI-DSI | GbE | - | USB 2.0 + PHY (2) | - | ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS | I²C, PCIe, SDHC, SPI, UART |
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