Compare | Image | Name | Manufacturer | Quantity | Mfr | Series | Package | Product Status | Operating Temperature | Applications | Mounting Type | Package / Case | Base Product Number | Current - Supply | Digi-Key Programmable | Voltage - Supply | Supplier Device Package | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Number of I/O | Core Processor | Core Size | Speed | Connectivity | Peripherals | Program Memory Size | Program Memory Type | EEPROM Size | RAM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Interface | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | SATA | USB | Voltage - I/O | Security Features | Additional Interfaces | Controller Series |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
NXP USA Inc. SPC5744PK1MLQ8R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC57xx | Tape & Reel (TR) | Obsolete | -40°C ~ 125°C (TA) | Surface Mount | 144-LQFP | SPC5744 | 144-LQFP (20x20) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935323582528 | OBSOLETE | 0000.00.0000 | 700 | 79 | e200z4 | 32-Bit Dual-Core | 180MHz | CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART | DMA, LVD, POR, WDT | 2.5MB (2.5M x 8) | FLASH | - | 384K x 8 | 3.15V ~ 5.5V | A/D 64x12b | Internal | ||||||||||||||||||||
NXP USA Inc. MC32PF1510A2EP | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Active | -40°C ~ 85°C | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | Surface Mount | 40-VFQFN Exposed Pad | MC32PF1510 | - | 3.8V ~ 7V | 40-HVQFN (5x5) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935371713557 | EAR99 | 8542.39.0001 | 490 | |||||||||||||||||||||||||||||
NXP USA Inc. MC32PF1510A6EPR2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Active | -40°C ~ 85°C | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | Surface Mount | 40-VFQFN Exposed Pad | MC32PF1510 | - | 3.8V ~ 7V | 40-HVQFN (5x5) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935371869528 | EAR99 | 8542.39.0001 | 5,000 | |||||||||||||||||||||||||||||
NXP USA Inc. MC34PF1510A2EPR2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Active | -40°C ~ 105°C | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | Surface Mount | 40-VFQFN Exposed Pad | MC34PF1510 | - | 3.8V ~ 7V | 40-HVQFN (5x5) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935371926528 | EAR99 | 8542.39.0001 | 5,000 | |||||||||||||||||||||||||||||
NXP USA Inc. MC34PF1510A3EP | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Active | -40°C ~ 105°C | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | Surface Mount | 40-VFQFN Exposed Pad | MC34PF1510 | - | 3.8V ~ 7V | 40-HVQFN (5x5) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935371924557 | EAR99 | 8542.39.0001 | 490 | |||||||||||||||||||||||||||||
NXP USA Inc. MC34PF1510A3EPR2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Active | -40°C ~ 105°C | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | Surface Mount | 40-VFQFN Exposed Pad | MC34PF1510 | - | 3.8V ~ 7V | 40-HVQFN (5x5) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935371924528 | EAR99 | 8542.39.0001 | 5,000 | |||||||||||||||||||||||||||||
NXP USA Inc. MC34PF1510A4EP | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Active | -40°C ~ 105°C | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | Surface Mount | 40-VFQFN Exposed Pad | MC34PF1510 | - | 3.8V ~ 7V | 40-HVQFN (5x5) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935371922557 | EAR99 | 8542.39.0001 | 490 | |||||||||||||||||||||||||||||
NXP USA Inc. MC34PF1510A5EP | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Active | -40°C ~ 105°C | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | Surface Mount | 40-VFQFN Exposed Pad | MC34PF1510 | - | 3.8V ~ 7V | 40-HVQFN (5x5) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935371919557 | EAR99 | 8542.39.0001 | 490 | |||||||||||||||||||||||||||||
NXP USA Inc. MC34PF1510A5EPR2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Active | -40°C ~ 105°C | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | Surface Mount | 40-VFQFN Exposed Pad | MC34PF1510 | - | 3.8V ~ 7V | 40-HVQFN (5x5) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935371919528 | EAR99 | 8542.39.0001 | 5,000 | |||||||||||||||||||||||||||||
NXP USA Inc. MC34PF1550A6EPR2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Active | -40°C ~ 105°C | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | Surface Mount | 40-VFQFN Exposed Pad | MC34PF1550 | - | 3.8V ~ 7V | 40-HVQFN (5x5) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935371936528 | EAR99 | 8542.39.0001 | 5,000 | |||||||||||||||||||||||||||||
NXP USA Inc. MC34PF1550A7EP | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Active | -40°C ~ 105°C | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | Surface Mount | 40-VFQFN Exposed Pad | MC34PF1550 | - | 3.8V ~ 7V | 40-HVQFN (5x5) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935371934557 | EAR99 | 8542.39.0001 | 490 | |||||||||||||||||||||||||||||
NXP USA Inc. MC32PF1510A1EPR2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Active | -40°C ~ 85°C | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | Surface Mount | 40-VFQFN Exposed Pad | MC32PF1510 | - | 3.8V ~ 7V | 40-HVQFN (5x5) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.39.0001 | 5,000 | ||||||||||||||||||||||||||||||
NXP USA Inc. MC32PF1510A3EPR2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Active | -40°C ~ 85°C | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | Surface Mount | 40-VFQFN Exposed Pad | MC32PF1510 | - | 3.8V ~ 7V | 40-HVQFN (5x5) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.39.0001 | 5,000 | ||||||||||||||||||||||||||||||
NXP USA Inc. A7101CHUK/T0BC2HAZ | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | A71CH | Tape & Reel (TR) | Obsolete | -25°C ~ 85°C (TA) | Authentication | Surface Mount | 12-UFBGA, WLCSP | A7101 | Not Verified | 2.5V ~ 3.6V | 12-WLCSP (2.06x2.02) | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | 5A992C | 8542.39.0001 | 3,000 | MX51 | - | - | I²C | - | |||||||||||||||||||||||||
NXP USA Inc. MC33PF8100A0ES | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Active | -40°C ~ 105°C (TA) | High Performance i.MX 8, S32x Processor Based | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | MC33PF8100 | - | 2.5V ~ 5.5V | 56-HVQFN (8x8) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.39.0001 | 260 | ||||||||||||||||||||||||||||||
NXP USA Inc. MC33PF8100CCES | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Active | -40°C ~ 105°C (TA) | High Performance i.MX 8, S32x Processor Based | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | MC33PF8100 | - | 2.5V ~ 5.5V | 56-HVQFN (8x8) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.39.0001 | 260 | ||||||||||||||||||||||||||||||
NXP USA Inc. MC34PF8100A0EP | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Active | -40°C ~ 105°C (TA) | High Performance i.MX 8, S32x Processor Based | Surface Mount | 56-VFQFN Exposed Pad | MC34PF8100 | - | 2.5V ~ 5.5V | 56-HVQFN (8x8) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.39.0001 | 260 | ||||||||||||||||||||||||||||||
![]() |
NXP USA Inc. MC34PF8101A0EP | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | * | Tray | Active | MC34PF8101 | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.39.0001 | 260 | ||||||||||||||||||||||||||||||||||||
NXP USA Inc. MC33PF8100CEES | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Active | -40°C ~ 105°C (TA) | High Performance i.MX 8, S32x Processor Based | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | MC33PF8100 | - | 2.5V ~ 5.5V | 56-HVQFN (8x8) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.39.0001 | 260 | ||||||||||||||||||||||||||||||
NXP USA Inc. MC33PF8100CHES | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Active | -40°C ~ 105°C (TA) | High Performance i.MX 8, S32x Processor Based | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | MC33PF8100 | - | 2.5V ~ 5.5V | 56-HVQFN (8x8) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935382407557 | 0000.00.0000 | 260 | ||||||||||||||||||||||||||||||
NXP USA Inc. MC34PF8100CEEP | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Obsolete | -40°C ~ 105°C (TA) | High Performance i.MX 8, S32x Processor Based | Surface Mount | 56-VFQFN Exposed Pad | MC34PF8100 | - | 2.5V ~ 5.5V | 56-HVQFN (8x8) | 3 (168 Hours) | REACH Unaffected | OBSOLETE | 0000.00.0000 | 260 | ||||||||||||||||||||||||||||||||
NXP USA Inc. MC33PF8100CFEP | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Obsolete | -40°C ~ 105°C (TA) | High Performance i.MX 8, S32x Processor Based | Surface Mount | 56-VFQFN Exposed Pad | MC33PF8100 | - | 2.5V ~ 5.5V | 56-HVQFN (8x8) | download | 3 (168 Hours) | REACH Unaffected | OBSOLETE | 0000.00.0000 | 260 | |||||||||||||||||||||||||||||||
NXP USA Inc. MC34PF8100CGEP | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Obsolete | -40°C ~ 105°C (TA) | High Performance i.MX 8, S32x Processor Based | Surface Mount | 56-VFQFN Exposed Pad | MC34PF8100 | - | 2.5V ~ 5.5V | 56-HVQFN (8x8) | 3 (168 Hours) | REACH Unaffected | OBSOLETE | 0000.00.0000 | 260 | ||||||||||||||||||||||||||||||||
NXP USA Inc. MC33PF8200D2ES | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Active | -40°C ~ 105°C (TA) | High Performance i.MX 8, S32x Processor Based | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | MC33PF8200 | - | 2.5V ~ 5.5V | 56-HVQFN (8x8) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935382409557 | 0000.00.0000 | 260 | ||||||||||||||||||||||||||||||
NXP USA Inc. MC33PF8200DBES | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Active | -40°C ~ 105°C (TA) | High Performance i.MX 8, S32x Processor Based | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | MC33PF8200 | - | 2.5V ~ 5.5V | 56-HVQFN (8x8) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935382424557 | 0000.00.0000 | 260 | ||||||||||||||||||||||||||||||
NXP USA Inc. MC33PF8200DEES | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Active | -40°C ~ 105°C (TA) | High Performance i.MX 8, S32x Processor Based | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | MC33PF8200 | - | 2.5V ~ 5.5V | 56-HVQFN (8x8) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935376115557 | 0000.00.0000 | 260 | ||||||||||||||||||||||||||||||
NXP USA Inc. MC33PF8200DGES | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Obsolete | -40°C ~ 105°C (TA) | High Performance i.MX 8, S32x Processor Based | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | MC33PF8200 | - | 2.5V ~ 5.5V | 56-HVQFN (8x8) | download | 3 (168 Hours) | REACH Unaffected | OBSOLETE | 0000.00.0000 | 260 | |||||||||||||||||||||||||||||||
NXP USA Inc. MCIMX281AVM4C | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX28 | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 289-LFBGA | MCIMX281 | 289-MAPBGA (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935369788557 | 5A992C | 8542.31.0001 | 760 | ARM926EJ-S | 454MHz | 1 Core, 32-Bit | Data; DCP | LVDDR, LVDDR2, DDR2 | No | Keypad | 10/100Mbps (1) | - | USB 2.0 + PHY (2) | 1.8V, 3.3V | Boot Security, Cryptography, Hardware ID | CAN, I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART | |||||||||||||||||||
NXP USA Inc. MCIMX286CVM4C | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX28 | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 289-LFBGA | MCIMX286 | 289-MAPBGA (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935369793557 | 5A992C | 8542.31.0001 | 760 | ARM926EJ-S | 454MHz | 1 Core, 32-Bit | Data; DCP | LVDDR, LVDDR2, DDR2 | No | Keyboard, LCD, Touchscreen | 10/100Mbps (1) | - | USB 2.0 + PHY (2) | 1.8V, 3.3V | Boot Security, Cryptography, Hardware ID | CAN, I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART | |||||||||||||||||||
NXP USA Inc. MCIMX286DVM4C | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX28 | Tray | Active | -20°C ~ 70°C (TA) | Surface Mount | 289-LFBGA | MCIMX286 | 289-MAPBGA (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935369799557 | 5A992C | 8542.31.0001 | 760 | ARM926EJ-S | 454MHz | 1 Core, 32-Bit | Data; DCP | LVDDR, LVDDR2, DDR2 | No | Keypad | 10/100Mbps (1) | - | USB 2.0 + PHY (2) | 1.8V, 3.3V | Boot Security, Cryptography, Hardware ID | CAN, I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART |
Please send RFQ , we will respond immediately.