| Compare | Image | Name | Manufacturer | Quantity | Mfr | Series | Package | Product Status | Operating Temperature | Applications | Mounting Type | Package / Case | Type | Base Product Number | Current - Supply | Digi-Key Programmable | Voltage - Supply | Supplier Device Package | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | ECCN | HTSUS | Standard Package | Function | Standards | Number of I/O | Core Processor | Core Size | Speed | Connectivity | Peripherals | Program Memory Size | Program Memory Type | EEPROM Size | RAM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Protocol | Interface | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | SATA | USB | Voltage - I/O | Security Features | Additional Interfaces | Clock Rate | Non-Volatile Memory | On-Chip RAM | Voltage - Core |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| NXP USA Inc. MIMX8MN3DVTJZAA | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX8MN | Tray | Active | 0°C ~ 95°C (TJ) | Surface Mount | 486-LFBGA, FCBGA | MIMX8MN3 | 486-LFBGA (14x14) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 152 | ARM® Cortex®-A53, ARM® Cortex®-M7 | 1.5GHz | 2 Core, 64-Bit | Multimedia; NEON™ MPE | DDR3L, DDR4, LPDDR4 | Yes | LCD, MIPI-CSI, MIPI-DSI | GbE | - | USB 2.0 + PHY (2) | - | ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS | I²C, PCIe, SDHC, SPI, UART | |||||||||||||||||||||||||||
| NXP USA Inc. MIMX8MN2CVTIZAA | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX8MN | Tray | Active | -40°C ~ 105°C (TJ) | Surface Mount | 486-LFBGA, FCBGA | MIMX8MN2 | 486-LFBGA (14x14) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 152 | ARM® Cortex®-A53 | 1.4GHz | 1 Core, 64-Bit | ARM® Cortex®-M7 | DDR3L, DDR4, LPDDR4 | Yes | LCD, MIPI-CSI, MIPI-DSI | GbE | - | USB 2.0 + PHY (2) | - | ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS | I²C, PCIe, SDHC, SPI, UART | |||||||||||||||||||||||||||
| NXP USA Inc. LPC55S28JBD64K | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | LPC55S2x | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 64-TQFP Exposed Pad | LPC55S28 | 64-HTQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 800 | 36 | ARM® Cortex®-M33 | 32-Bit Single-Core | 150MHz | Flexcomm, I²C, MMC/SD/SDIO, SPI, UART/USART, USB | Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT | 512KB (512K x 8) | FLASH | - | 256K x 8 | 1.8V ~ 3.6V | A/D 10x16b | Internal | ||||||||||||||||||||||||||
| NXP USA Inc. LPC5526JBD100K | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | LPC552x | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 100-LQFP Exposed Pad | LPC5526 | 100-HLQFP (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 450 | 64 | ARM® Cortex®-M33 | 32-Bit Single-Core | 150MHz | Flexcomm, I²C, MMC/SD/SDIO, SPI, UART/USART, USB | Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT | 256KB (256K x 8) | FLASH | - | 144K x 8 | 1.8V ~ 3.6V | A/D 10x16b | Internal | ||||||||||||||||||||||||||
| NXP USA Inc. LPC5526JEV98K | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | LPC552x | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 98-VFBGA | LPC5526 | 98-VFBGA (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 1,300 | 64 | ARM® Cortex®-M33 | 32-Bit Single-Core | 150MHz | Flexcomm, I²C, MMC/SD/SDIO, SPI, UART/USART, USB | Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT | 256KB (256K x 8) | FLASH | - | 144K x 8 | 1.8V ~ 3.6V | A/D 10x16b | Internal | ||||||||||||||||||||||||||
| NXP USA Inc. LPC5528JBD100K | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | LPC552x | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 100-LQFP Exposed Pad | LPC5528 | 100-HLQFP (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 450 | 64 | ARM® Cortex®-M33 | 32-Bit Single-Core | 150MHz | Flexcomm, I²C, MMC/SD/SDIO, SPI, UART/USART, USB | Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT | 512KB (512K x 8) | FLASH | - | 256K x 8 | 1.8V ~ 3.6V | A/D 10x16b | Internal | ||||||||||||||||||||||||||
| NXP USA Inc. LPC5528JBD64K | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | LPC552x | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 64-TQFP Exposed Pad | LPC5528 | 64-HTQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 800 | 36 | ARM® Cortex®-M33 | 32-Bit Single-Core | 150MHz | Flexcomm, I²C, MMC/SD/SDIO, SPI, UART/USART, USB | Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT | 512KB (512K x 8) | FLASH | - | 256K x 8 | 1.8V ~ 3.6V | A/D 10x16b | Internal | ||||||||||||||||||||||||||
| NXP USA Inc. LPC55S66JBD64K | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | LPC55S6x | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 64-TQFP Exposed Pad | LPC55S66 | 64-HTQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 8542.31.0001 | 800 | 36 | ARM® Cortex®-M33 | 32-Bit Single-Core | 150MHz | Flexcomm, I²C, MMC/SD/SDIO, SPI, UART/USART, USB | Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT | 256KB (256K x 8) | FLASH | - | 144K x 8 | 1.8V ~ 3.6V | A/D 10x16b | Internal | |||||||||||||||||||||||||||
| NXP USA Inc. LPC55S26JEV98K | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | LPC55S2x | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 98-VFBGA | LPC55S26 | 98-VFBGA (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 1,300 | 64 | ARM® Cortex®-M33 | 32-Bit Single-Core | 150MHz | Flexcomm, I²C, MMC/SD/SDIO, SPI, UART/USART, USB | Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT | 256KB (256K x 8) | FLASH | - | 144K x 8 | 1.8V ~ 3.6V | A/D 10x16b | Internal | ||||||||||||||||||||||||||
| NXP USA Inc. LPC5526JBD64K | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | LPC552x | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 64-TQFP Exposed Pad | LPC5526 | 64-HTQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 800 | 36 | ARM® Cortex®-M33 | 32-Bit Single-Core | 150MHz | Flexcomm, I²C, MMC/SD/SDIO, SPI, UART/USART, USB | Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT | 256KB (256K x 8) | FLASH | - | 144K x 8 | 1.8V ~ 3.6V | A/D 10x16b | Internal | ||||||||||||||||||||||||||
 |
NXP USA Inc. LS1027ASN7KQA | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | QorIQ® Layerscape | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 448-BFBGA | LS1027 | 448-FBGA (17x17) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 90 | ARM® Cortex®-A72 | 1GHz | 2 Core, 64-Bit | - | DDR3L SDRAM, DDR4 SDRAM | - | - | 1Gbps (1), 2.5Gbps (5) | SATA 6Gbps (1) | - | - | - | CANbus, I²C, SPI, UART | ||||||||||||||||||||||||||||
|
NXP USA Inc. SP5748CSK0AMKU6R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC57xx | Tape & Reel (TR) | Active | -40°C ~ 125°C (TA) | Surface Mount | 176-LQFP Exposed Pad | SP5748 | 176-LQFP (24x24) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 500 | 129 | e200z2, e200z4 | 32-Bit Dual-Core | 80MHz, 160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 6MB (6M x 8) | FLASH | - | 768K x 8 | 3.15V ~ 5.5V | A/D 48x10b, 16x12b | Internal | ||||||||||||||||||||||||||||
|
NXP USA Inc. LS1027AXE7KQA | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | QorIQ® Layerscape | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 448-BFBGA | LS1027 | 448-FBGA (17x17) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 90 | ARM® Cortex®-A72 | 1GHz | 2 Core, 64-Bit | - | DDR3L SDRAM, DDR4 SDRAM | - | - | 1Gbps (1), 2.5Gbps (5) | SATA 6Gbps (1) | - | - | - | CANbus, I²C, SPI, UART | ||||||||||||||||||||||||||||
| NXP USA Inc. FS32K116BRT0MFMT | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S32K | Tray | Active | -40°C ~ 125°C (TA) | Surface Mount | 32-VFQFN Exposed Pad | FS32K116 | 32-HVQFN (5x5) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 490 | 28 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 48MHz | CANbus, FlexIO, I²C, LINbus, SPI, UART/USART | DMA, PWM, WDT | 128KB (128K x 8) | FLASH | 2K x 8 | 17K x 8 | 2.7V ~ 5.5V | A/D 13x12b SAR; D/A 1x8b | Internal | |||||||||||||||||||||||||||
| NXP USA Inc. LPC55S69JBD100Y | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | LPC55S6x | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 100-LQFP Exposed Pad | LPC55S69 | 100-HLQFP (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 1,000 | 64 | ARM® Cortex®-M33 | 32-Bit Single-Core | 150MHz | Flexcomm, I²C, MMC/SD/SDIO, SPI, UART/USART, USB | Brown-out Detect/Reset, DMA, I²S, POR, PWM, RNG, WDT | 640KB (640K x 8) | FLASH | - | 320K x 8 | 1.8V ~ 3.6V | A/D 10x16b | Internal | ||||||||||||||||||||||||||||
|
NXP USA Inc. S9KEAZN8ACFKR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis KEA | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 24-VFQFN Exposed Pad | S9KEAZN8 | 24-QFN (4x4) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5,000 | 22 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 48MHz | I²C, LINbus, SPI, UART/USART | LVD, POR, PWM, WDT | 8KB (8K x 8) | FLASH | - | 1K x 8 | 2.7V ~ 5.5V | A/D 12x12b | Internal | |||||||||||||||||||||||||||
| NXP USA Inc. FS32K116BRT0VFMR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S32K | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 32-VFQFN Exposed Pad | FS32K116 | 32-HVQFN (5x5) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 5,000 | 28 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 48MHz | CANbus, FlexIO, I²C, LINbus, SPI, UART/USART | DMA, PWM, WDT | 128KB (128K x 8) | FLASH | 2K x 8 | 17K x 8 | 2.7V ~ 5.5V | A/D 13x12b SAR; D/A 1x8b | Internal | |||||||||||||||||||||||||||
|
NXP USA Inc. LS1028ASE7KQA | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | QorIQ® Layerscape | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 448-BFBGA | LS1028 | 448-FBGA (17x17) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 90 | ARM® Cortex®-A72 | 1GHz | 2 Core, 64-Bit | - | DDR3L SDRAM, DDR4 SDRAM | - | - | 1Gbps (1), 2.5Gbps (5) | SATA 6Gbps (1) | - | - | - | CANbus, I²C, SPI, UART | ||||||||||||||||||||||||||||
| NXP USA Inc. MIMXRT106FDVL6A | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | RT1060 | Tray | Discontinued at Digi-Key | 0°C ~ 95°C (TJ) | Surface Mount | 196-LFBGA | MIMXRT106 | 196-MAPBGA (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 240 | 127 | ARM® Cortex®-M7 | 32-Bit Single-Core | 600MHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG | Brown-out Detect/Reset, DMA, POR, PWM, WDT | - | External Program Memory | - | 1M x 8 | - | A/D 20x12b | External, Internal | ||||||||||||||||||||||||||
|
NXP USA Inc. TEA19032CABT/1J | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Obsolete | -40°C ~ 150°C (TJ) | 10-SOIC (0.154", 3.90mm Width) | TEA19032 | 3mA | Not Verified | 2.9V ~ 21V | 10-SO | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | OBSOLETE | 2,500 | Controller | USB 2.0, USB 3.0 | USB | USB | |||||||||||||||||||||||||||||||||
|
NXP USA Inc. MC33FS8410G3ESR2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | * | Tape & Reel (TR) | Active | MC33FS8410 | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.39.0001 | 4,000 | |||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MC9S08PA32AVLDR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 44-LQFP | MC9S08 | 44-LQFP (10x10) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 1,500 | 37 | S08 | 8-Bit | 20MHz | I²C, LINbus, SPI, UART/USART | LVD, POR, PWM, WDT | 32KB (32K x 8) | FLASH | 256 x 8 | 4K x 8 | 2.7V ~ 5.5V | A/D 12x12b | Internal | |||||||||||||||||||||||||||||
|
NXP USA Inc. SAF775CHN/N208Z/KK | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | SAF77x | Tray | Obsolete | - | Surface Mount | 184-VQFN Multi Row, Exposed Pad | Audio, Car Signal Processor | SAF775 | 184-HVQFN (12x12) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | OBSOLETE | 840 | - | - | - | - | - | - | |||||||||||||||||||||||||||||||||
|
NXP USA Inc. MC33VR5500V2ESR2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | * | Tape & Reel (TR) | Active | MC33VR5500 | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.39.0001 | 4,000 | |||||||||||||||||||||||||||||||||||||||||||
|
NXP USA Inc. TEA1999DB1546 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | * | Box | Active | TEA1999 | Not Verified | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8542.39.0001 | 1 | ||||||||||||||||||||||||||||||||||||||||||
|
NXP USA Inc. SPC5744PK1AMMM9R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC57xx | Tape & Reel (TR) | Active | -40°C ~ 125°C (TA) | Surface Mount | 257-LFBGA | SPC5744 | 257-LFBGA (14x14) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 1,000 | e200z2, e200z4 | 32-Bit Dual-Core | 80MHz, 200MHz | CANbus, Ethernet, FlexRay, I²C, LINbus, SPI | DMA, I²S, POR, WDT | 2.5MB (2.5M x 8) | FLASH | 64K x 8 | 384K x 8 | 3.15V ~ 5.5V | A/D 36x10b, 16x12b | Internal | |||||||||||||||||||||||||||||
| NXP USA Inc. MC33PF8200EMESR2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | High Performance i.MX 8, S32x Processor Based | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | MC33PF8200 | - | 2.5V ~ 5.5V | 56-HVQFN (8x8) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.39.0001 | 4,000 | ||||||||||||||||||||||||||||||||||||
| NXP USA Inc. S912ZVC96F0VLF | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S12 MagniV | Tray | Obsolete | -40°C ~ 105°C (TA) | Surface Mount | 48-LQFP | S912 | 48-LQFP (7x7) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 1,250 | 28 | S12Z | 16-Bit | 32MHz | CANbus, I²C, SCI, SPI | DMA, POR, PWM, WDT | 96KB (96K x 8) | FLASH | 2K x 8 | 8K x 8 | 3.5V ~ 40V | A/D 10x10b | Internal | |||||||||||||||||||||||||||
|
NXP USA Inc. SP5746CTK1AVKU6R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC57xx | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 176-LQFP Exposed Pad | SP5746 | 176-LQFP (24x24) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 500 | 129 | e200z2, e200z4 | 32-Bit Dual-Core | 80MHz, 160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 3MB (3M x 8) | FLASH | 128K x 8 | 384K x 8 | 3.15V ~ 5.5V | A/D 36x10b, 16x12b | Internal | ||||||||||||||||||||||||||||
|
NXP USA Inc. LS1017AXE7KQA | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | QorIQ® Layerscape | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 448-BFBGA | LS1017 | 448-FBGA (17x17) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 90 | ARM® Cortex®-A72 | 1GHz | 1 Core, 64-Bit | - | DDR3L SDRAM, DDR4 SDRAM | - | - | 1Gbps (1), 2.5Gbps (5) | SATA 6Gbps (1) | - | - | - | CANbus, I²C, SPI, UART |
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